OpenFieldIDL Summer Energy Modeling and Daylighting Internship
University of Idaho Integrated Design Lab · Boise, Idaho, United States
Academic Overview & Description
Ten-week paid technical fellowship performing physical sky-simulator testing, architectural daylight sensor calibration, and OpenStudio utility code compliance audits.
Funding & Financial Support
- Funding Award
- Stipend of $7,500 for the 10-week summer term plus travel support
- Tuition Rate
- $0
- Application Fee
- $0
Admission & Candidate Requirements
- Academic GPA
- 3.2+ GPA in architecture, architectural engineering, or building science
- English Language
- IELTS 6.5 or TOEFL 79
- Standardized Exam
- Not required
- Application Materials
- Resume, cover letter detailing simulation software experience (Rhino, Ladybug, EnergyPlus)
- Letters of Recommendation
- Two faculty letters of recommendation
Institutional Guidance
For official application submission procedures, portal logins, and faculty matching, consult University of Idaho Integrated Design Lab's detailed profile or visit the department application portal.
Verified record · Updated 2026-10-16 · Editorial standards