FELLOWSHIP · UNITED STATES · VERIFIED RECORD

Texas Institute for Electronics (TIE) Semiconductor Postdoctoral Fellowship

University of Texas System · Austin, Texas, United States

Target Discipline: engineeringApplication Deadline: February 1, 2027Official admissions notice ↗

Academic Overview & Description

State-supported semiconductor defense fellowship utilizing cleanroom fabrication facilities at UT Austin to research 3D heterogeneous packaging and microchip security.

Funding & Financial Support

Funding Award: Annual salary of $78,000 plus full institutional health insurance and $10,000 fab materials budget
Tuition Rate: $0
Application Fee: $0

Admission & Candidate Requirements

Academic GPA: Ph.D. in electrical engineering, materials science, or applied physics
English Language: Satisfied by terminal doctorate
Standardized Exam: Not required
Application Materials: Curriculum vitae, 3 high-impact microelectronics publications, 3-page research proposal
Letters of Recommendation: Three letters of recommendation from international semiconductor researchers

Institutional Guidance

For official application submission procedures, portal logins, and faculty matching, consult University of Texas System's detailed profile or visit the department application portal.

Verified record · Updated 2026-10-16 · Editorial standards