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Japan · Scholarship · Reviewed 2026-10-15

HUS International STEM Scholars Special Tuition Reduction Award

Tuition waiver scholarship awarded by Hokkaido University of Science to support talented international scholars pursuing degrees in engineering and robotics in Sapporo.

Official university details ↗Research checked, not sponsored

Application checklist & requirements

These requirements reflect published university guidelines available at the last review. Review official department guidelines before submission.

Academic degree / Prerequisites
Prior educational GPA of 3.0/4.0 in mathematics, physics, and chemistry coursework.
English language proficiency
JLPT N2 minimum for Japanese-track engineering; IELTS 6.0 for English-track research labs.
Standardized testing (GRE/GMAT)
EJU (Examination for Japanese University Admission) scores in Science and Mathematics strongly recommended.
Thesis / Research statement
Personal statement detailing technological interests and career aspirations in robotics or cold-region engineering.
Recommendation letters
Two letters of recommendation from high school or university science professors.

How much will it cost? How much funding is available?

Financial support / stipend
Direct tuition reduction: 30% to 50% remission of annual tuition fees across all academic years
Application fee
¥35,000 examination application fee
Tuition / joining costs
¥1,250,000/year standard engineering tuition; reduced to ¥625,000–¥875,000/year with scholarship

Dates and verification

Application deadline
15 January 2027 (Spring International Entrance Round)
Last source review
2026-10-15

Important verification note

Facts reflect official Hokkaido University of Science documentation reviewed 2026-10-15. Admissions, funding allocations, and eligibility thresholds are evaluated by the university.

Reviewed 2026-10-15 · Editorial standards · Report an issue