OpenFieldFellowship in Sustainable Cardboard Rheology and Void-Reduction Packaging
Research fellowship investigating recycled corrugated fiberboard tensile strength, optimal creasing pressure, and 50% box volume reduction for global e-commerce supply chains.
Application checklist & requirements
These requirements reflect published university guidelines available at the last review. Review official department guidelines before submission.
- Academic degree / Prerequisites
- Master's degree in Materials Science, Chemical Engineering, or Structural Mechanics.
- English language proficiency
- English C1.
- Standardized testing (GRE/GMAT)
- Not required.
- Thesis / Research statement
- Research proposal on packaging fiber physics (2,500 words) and list of publications.
- Recommendation letters
- Two academic letters.
How much will it cost? How much funding is available?
- Financial support / stipend
- €5,500 research grant funded by Dutch Topsector High Tech Systems and Materials (HTSM)
- Application fee
- €0
- Tuition / joining costs
- Tuition fully covered
Dates and verification
- Application deadline
- May 30, 2027
- Last source review
- 2026-10-15
Important verification note
Facts reflect official Sparck B.V. Academic Logistics & Packaging Center documentation reviewed 2026-10-15. Admissions, funding allocations, and eligibility thresholds are evaluated by the university.
Reviewed 2026-10-15 · Editorial standards · Report an issue