Four-year curriculum focusing on power electronics, renewable solar/wind generation, semiconductor device fabrication, and embedded electronic control systems.
- Type
- Bachelor's
- Deadline
- December 10, 2026
- Funding
- Tohtech Science & Technology Scholarship providing 30% to 50% tuition waiver
Full details & requirements ↗
Rigorous undergraduate program examining 5G/6G wireless networks, artificial intelligence algorithms, computer vision, data security, and distributed edge computing.
- Type
- Bachelor's
- Deadline
- December 10, 2026
- Funding
- Digital Transformation Future Leader Grant (¥250,000 annual tuition reduction)
Full details & requirements ↗
JABEE-accredited program training professional architects and structural engineers in earthquake-resistant design, building information modeling (BIM), and timber structural engineering.
- Type
- Bachelor's
- Deadline
- January 8, 2027
- Funding
- Tohoku Architectural Heritage Scholarship offering partial fee waiver
Full details & requirements ↗
Four-year curriculum addressing coastal tsunami defenses, geotechnical foundation safety, smart transportation grids, and ecological river basin preservation.
- Type
- Bachelor's
- Deadline
- January 8, 2027
- Funding
- Disaster Resilient City Grant providing ¥200,000 annual subsidy
Full details & requirements ↗
Two-year research master's degree investigating intelligent power grids, autonomous robotic navigation, structural health monitoring, and geospatial data modeling.
- Type
- Master's
- Deadline
- January 25, 2027
- Funding
- Tohtech Graduate Research Fellowship (50% tuition exemption plus paid research assistantship)
Full details & requirements ↗
Three-year doctoral research program producing independent scholars and industrial R&D leaders in advanced electronic materials, structural disaster mitigation, and cyber-physical systems.
- Type
- PhD
- Deadline
- February 10, 2027
- Funding
- Full tuition exemption plus ¥150,000 monthly living stipend via institutional doctoral fellowship
Full details & requirements ↗
Merit-based institutional aid program to support outstanding international students conducting experimental thesis research in electrical, architectural, and software engineering.
- Type
- Scholarship
- Deadline
- February 15, 2027
- Funding
- Waiver of 30% to 100% of tuition and fees for selected international science and engineering candidates
Full details & requirements ↗